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 H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
October 2005
H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Features
Bi-polar emitter input Built-in reverse polarity input protection Underwriters Laboratory (UL) recognized - File #E90700 VDE approved - File #E94766 (ordering option `300')
Description
The H11AAX series consists of two gallium-arsenide infrared emitting diodes connected in inverse parallel driving a single silicon phototransistor output.
Applications
AC line monitor Unknown polarity DC sensor Telephone line interface
1
6 BASE
6 1
6
2
5 COLL
1
3
4 EMITTER
6 1
Parameter
TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation Derate Linearly From 25C EMITTER Continuous Forward Current Forward Current - Peak (1 s pulse, 300 pps) LED Power Dissipation Derate Linearly From 25C DETECTOR Detector Power Dissipation Derate above 25C
Symbol
TSTG TOPR TSOL PD
Device
All All All All
Value
-55 to +150 -55 to +100 260 for 10 sec 350 4.6
Units
C C C mW mW/C
IF IF(pk) PD
All All All
100 1.0 200 2.6
mA A mW mW/C
PD
All
300 4.0
mW mW/C
(c)2005 Fairchild Semiconductor Corporation
1
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H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Electrical Characteristics (TA = 25C Unless otherwise specified.)
Individual Component Characteristics Parameter Test Conditions
EMITTER Input Forward Voltage Capacitance DETECTOR Breakdown Voltage Collector to Emitter Collector to Base Emitter to Base Emitter to Collector Leakage Current Collector to Emitter Capacitance Collector to Emitter Collector to Base Emitter to Base IC = 1.0 mA, IF = 0 IC = 100 A, IF = 0 IE = 100 A, IF = 0 IE = 100 A, IF = 0 VCE = 10 V, IF = 0 VCE = 0, f = 1 MHz VCE = 0, f = 1 MHz VCE = 0, f = 1 MHz BVCEO BVCBO BVEBO BVECO ICEO CCE CCB CEB All All All All H11AA1,3,4 H11AA2 All All All 10 80 15 30 70 5 7 50 200 pF pF pF V V V V nA IF = 10 mA VF = 0 V, f = 1.0 MHz VF CJ All All 1.2 80 1.5 V pF
Symbol
Device
Min
Typ
Max
Unit
Transfer Characteristics (TA = 25C Unless otherwise specified.)
Characteristics
Current Transfer Ratio, Collector to Emitter
Test Conditions
IF = 10 mA, VCE = 10 V
Symbol Device
CTRCE H11AA4 H11AA3 H11AA1 H11AA2
Min
100 50 20 10 .33
Typ
Max
Units
%
Current Transfer Ratio, Symmetry Saturation Voltage Collector to Emitter
IF = 10 mA, VCE = 10 V (Figure.8) IF = 10 mA, ICE = 0.5 mA VCE(SAT)
All All
3.0 .40 V
Isolation Characteristics
Characteristic
Package Capacitance input/output Isolation Voltage Isolation Resistance
Test Conditions
VI-O = 0, f = 1 MHz f = 60 Hz, t = 1 min. VI-O = 500 VDC
Symbol
CI-O VISO RISO
Min
5300 1011
Typ
0.7
Max
Units
pF VAC(RMS)
2 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Fig. 1 Input Voltage vs. Input Current
100 80 1.2 60 1.4
Fig. 2 Normalized CTR vs. Forward Current
VCE = 5.0V TA = 25C Normalized to IF = 10 mA
I F - INPUT CURRENT (mA)
40 20 0 -20 -40 -60
1.0
NORMALIZED CTR
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0
0.8
0.6
0.4
0.2 -80 -100 -2.0 0.0 0 5 10 15 20
VF - INPUT VOLTAGE (V)
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized CTR vs. Ambient Temperature
1.6 1.0
Fig. 4 CTR vs. RBE (Unsaturated)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
0.9 0.8
IF = 20 mA VCE= 5.0 V
1.4
IF = 5 mA
NORMALIZED CTR
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
IF = 5 mA IF = 10 mA
1.2
IF = 10 mA
1.0
0.8
0.6
Normalized to IF = 10 mA TA = 25C
IF = 20 mA
0.4 -75
-50
-25
0
25
50
75
100
125
10
100
1000
TA - AMBIENT TEMPERATURE (C)
RBE- BASE RESISTANCE (k)
Fig. 5 CTR vs. RBE (Saturated)
1.0
Fig. 6 Collector-Emitter Saturation Voltage vs Collector Current
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
100
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
0.9
VCE= 0.3 V
0.8
IF = 20 mA
10
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
IF = 5 mA IF = 10 mA
1
IF = 2.5 mA
0.1
0.01
IF = 10 mA IF = 5 mA
IF = 20 mA
10
100
1000
TA = 25C
RBE- BASE RESISTANCE (k)
0.001 0.01
0.1
1
10
IC - COLLECTOR CURRENT (mA)
3 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Fig. 7 Switching Speed vs. Load Resistor
1000
IF = 10 mA VCC = 10 V TA = 25C
Fig. 8 Normalized ton vs. RBE
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
VCC = 10 V IC = 2 mA RL = 100
100
Toff
10
Ton
Tf
1
Tr
0.1 0.1 1 10 100
NORMALIZED ton - (ton(RBE) / ton(open))
SWITCHING SPEED - (s)
10
100
1000
10000
100000
R-LOAD RESISTOR (k
RBE- BASE RESISTANCE (k
Fig. 9 Normalized toff vs. RBE
1.4 1.3 10000
Fig. 10 Dark Current vs. Ambient Temperature
ICEO - COLLECTOR -EMITTER DARK CURRENT (nA)
VCE = 10 V TA = 25C
NORMALIZED toff - (toff(RBE) / toff(open))
1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 10000 100000
VCC = 10 V IC = 2 mA RL = 100
1000
100
10
1
0.1
0.01
0.001
RBE- BASE RESISTANCE (k)
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (C)
Fig. 11 Output Symmetry Characteristics
10 5
NORMALIZED OUTPUT CURRENT
IF =
I - 10mA I I 10mA I
1 .5
IF =
.1 .05
NORMALIZED TO: VCE = 10 V IF = 10 mA THE MAXIMUM PEAK OUTPUT CURRENT WILL BE NO MORE THAN THREE TIMES THE MINIMUM PEAK OUTPUT CURRENT AT IF = 10 mA
.01 .005
.01
.05
.1
.5
1
5
10
VCE- COLLECTOR TO EMITTER VOLTAGE (V)
4 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Package Dimensions (Through Hole)
PIN 1 ID.
Package Dimensions (Surface Mount)
0.350 (8.89) 0.330 (8.38)
0.270 (6.86) 0.240 (6.10)
3
2
1
PIN 1 ID.
0.270 (6.86) 0.240 (6.10) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 4 5 6
0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.154 (3.90) 0.100 (2.54) 0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 0.300 (7.62) TYP 0.022 (0.56) 0.016 (0.41) 0.020 (0.51) MIN 0.100 (2.54) TYP
0.300 (7.62) TYP
0.016 (0.41) 0.008 (0.20)
0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4"Lead Spacing)
Recommended Pad Layout for Surface Mount Leadform
0.270 (6.86) 0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14)
0.415 (10.54)
0.100 (2.54) 0.030 (0.76)
SEATING PLANE
0.295 (7.49)
0.200 (5.08) 0.135 (3.43)
0.154 (3.90) 0.100 (2.54)
0.004 (0.10) MIN
0.016 (0.40) 0.008 (0.20)
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP
0 to 15 0.400 (10.16) TYP
Note All dimensions are in inches (millimeters)
5 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Ordering Information
Option
S SD W 300 300W 3S 3SD
Order Entry Identifier
.S .SD .W .300 .300W .3S .3SD
Description
Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape and Reel
Carrier Tape Specifications ("D" Taping Orientation)
12.0 0.1 4.85 0.20 0.30 0.05 4.0 0.1 4.0 0.1 O1.55 0.05 1.75 0.10
7.5 0.1 13.2 0.2 9.55 0.20 16.0 0.3
0.1 MAX
10.30 0.20
O1.6 0.1
User Direction of Feed
Note All dimensions are in millimeters
6 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
Marking Information
1
H11AA1 V XX YY K
3 4 5
2 6
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) Two digit year code, e.g., `03' Two digit work week ranging from `01' to `53' Assembly package code
Reflow Profile (Black Package, No Suffix)
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute)
Time above 183C, 60-150 sec 215C, 10-30 s
225 C peak
Ramp up = 3C/sec
* Peak reflow temperature: 225C (package surface temperature) * Time of temperature higher than 183C for 60-150 seconds * One time soldering reflow is recommended
7 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM 2 E CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise Programmable Active DroopTM
DISCLAIMER
ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM
PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET UniFETTM VCXTM WireTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I16
8 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
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