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H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers October 2005 H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Features Bi-polar emitter input Built-in reverse polarity input protection Underwriters Laboratory (UL) recognized - File #E90700 VDE approved - File #E94766 (ordering option `300') Description The H11AAX series consists of two gallium-arsenide infrared emitting diodes connected in inverse parallel driving a single silicon phototransistor output. Applications AC line monitor Unknown polarity DC sensor Telephone line interface 1 6 BASE 6 1 6 2 5 COLL 1 3 4 EMITTER 6 1 Parameter TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation Derate Linearly From 25C EMITTER Continuous Forward Current Forward Current - Peak (1 s pulse, 300 pps) LED Power Dissipation Derate Linearly From 25C DETECTOR Detector Power Dissipation Derate above 25C Symbol TSTG TOPR TSOL PD Device All All All All Value -55 to +150 -55 to +100 260 for 10 sec 350 4.6 Units C C C mW mW/C IF IF(pk) PD All All All 100 1.0 200 2.6 mA A mW mW/C PD All 300 4.0 mW mW/C (c)2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Electrical Characteristics (TA = 25C Unless otherwise specified.) Individual Component Characteristics Parameter Test Conditions EMITTER Input Forward Voltage Capacitance DETECTOR Breakdown Voltage Collector to Emitter Collector to Base Emitter to Base Emitter to Collector Leakage Current Collector to Emitter Capacitance Collector to Emitter Collector to Base Emitter to Base IC = 1.0 mA, IF = 0 IC = 100 A, IF = 0 IE = 100 A, IF = 0 IE = 100 A, IF = 0 VCE = 10 V, IF = 0 VCE = 0, f = 1 MHz VCE = 0, f = 1 MHz VCE = 0, f = 1 MHz BVCEO BVCBO BVEBO BVECO ICEO CCE CCB CEB All All All All H11AA1,3,4 H11AA2 All All All 10 80 15 30 70 5 7 50 200 pF pF pF V V V V nA IF = 10 mA VF = 0 V, f = 1.0 MHz VF CJ All All 1.2 80 1.5 V pF Symbol Device Min Typ Max Unit Transfer Characteristics (TA = 25C Unless otherwise specified.) Characteristics Current Transfer Ratio, Collector to Emitter Test Conditions IF = 10 mA, VCE = 10 V Symbol Device CTRCE H11AA4 H11AA3 H11AA1 H11AA2 Min 100 50 20 10 .33 Typ Max Units % Current Transfer Ratio, Symmetry Saturation Voltage Collector to Emitter IF = 10 mA, VCE = 10 V (Figure.8) IF = 10 mA, ICE = 0.5 mA VCE(SAT) All All 3.0 .40 V Isolation Characteristics Characteristic Package Capacitance input/output Isolation Voltage Isolation Resistance Test Conditions VI-O = 0, f = 1 MHz f = 60 Hz, t = 1 min. VI-O = 500 VDC Symbol CI-O VISO RISO Min 5300 1011 Typ 0.7 Max Units pF VAC(RMS) 2 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Fig. 1 Input Voltage vs. Input Current 100 80 1.2 60 1.4 Fig. 2 Normalized CTR vs. Forward Current VCE = 5.0V TA = 25C Normalized to IF = 10 mA I F - INPUT CURRENT (mA) 40 20 0 -20 -40 -60 1.0 NORMALIZED CTR -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0.8 0.6 0.4 0.2 -80 -100 -2.0 0.0 0 5 10 15 20 VF - INPUT VOLTAGE (V) IF - FORWARD CURRENT (mA) Fig. 3 Normalized CTR vs. Ambient Temperature 1.6 1.0 Fig. 4 CTR vs. RBE (Unsaturated) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.8 IF = 20 mA VCE= 5.0 V 1.4 IF = 5 mA NORMALIZED CTR 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 IF = 5 mA IF = 10 mA 1.2 IF = 10 mA 1.0 0.8 0.6 Normalized to IF = 10 mA TA = 25C IF = 20 mA 0.4 -75 -50 -25 0 25 50 75 100 125 10 100 1000 TA - AMBIENT TEMPERATURE (C) RBE- BASE RESISTANCE (k) Fig. 5 CTR vs. RBE (Saturated) 1.0 Fig. 6 Collector-Emitter Saturation Voltage vs Collector Current VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 100 NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 VCE= 0.3 V 0.8 IF = 20 mA 10 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 IF = 5 mA IF = 10 mA 1 IF = 2.5 mA 0.1 0.01 IF = 10 mA IF = 5 mA IF = 20 mA 10 100 1000 TA = 25C RBE- BASE RESISTANCE (k) 0.001 0.01 0.1 1 10 IC - COLLECTOR CURRENT (mA) 3 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Fig. 7 Switching Speed vs. Load Resistor 1000 IF = 10 mA VCC = 10 V TA = 25C Fig. 8 Normalized ton vs. RBE 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 VCC = 10 V IC = 2 mA RL = 100 100 Toff 10 Ton Tf 1 Tr 0.1 0.1 1 10 100 NORMALIZED ton - (ton(RBE) / ton(open)) SWITCHING SPEED - (s) 10 100 1000 10000 100000 R-LOAD RESISTOR (k RBE- BASE RESISTANCE (k Fig. 9 Normalized toff vs. RBE 1.4 1.3 10000 Fig. 10 Dark Current vs. Ambient Temperature ICEO - COLLECTOR -EMITTER DARK CURRENT (nA) VCE = 10 V TA = 25C NORMALIZED toff - (toff(RBE) / toff(open)) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 10000 100000 VCC = 10 V IC = 2 mA RL = 100 1000 100 10 1 0.1 0.01 0.001 RBE- BASE RESISTANCE (k) 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (C) Fig. 11 Output Symmetry Characteristics 10 5 NORMALIZED OUTPUT CURRENT IF = I - 10mA I I 10mA I 1 .5 IF = .1 .05 NORMALIZED TO: VCE = 10 V IF = 10 mA THE MAXIMUM PEAK OUTPUT CURRENT WILL BE NO MORE THAN THREE TIMES THE MINIMUM PEAK OUTPUT CURRENT AT IF = 10 mA .01 .005 .01 .05 .1 .5 1 5 10 VCE- COLLECTOR TO EMITTER VOLTAGE (V) 4 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Package Dimensions (Through Hole) PIN 1 ID. Package Dimensions (Surface Mount) 0.350 (8.89) 0.330 (8.38) 0.270 (6.86) 0.240 (6.10) 3 2 1 PIN 1 ID. 0.270 (6.86) 0.240 (6.10) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 4 5 6 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.154 (3.90) 0.100 (2.54) 0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 0.300 (7.62) TYP 0.022 (0.56) 0.016 (0.41) 0.020 (0.51) MIN 0.100 (2.54) TYP 0.300 (7.62) TYP 0.016 (0.41) 0.008 (0.20) 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4"Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.270 (6.86) 0.240 (6.10) 0.070 (1.78) 0.060 (1.52) 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 0.415 (10.54) 0.100 (2.54) 0.030 (0.76) SEATING PLANE 0.295 (7.49) 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 0.400 (10.16) TYP Note All dimensions are in inches (millimeters) 5 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Ordering Information Option S SD W 300 300W 3S 3SD Order Entry Identifier .S .SD .W .300 .300W .3S .3SD Description Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape and Reel Carrier Tape Specifications ("D" Taping Orientation) 12.0 0.1 4.85 0.20 0.30 0.05 4.0 0.1 4.0 0.1 O1.55 0.05 1.75 0.10 7.5 0.1 13.2 0.2 9.55 0.20 16.0 0.3 0.1 MAX 10.30 0.20 O1.6 0.1 User Direction of Feed Note All dimensions are in millimeters 6 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers Marking Information 1 H11AA1 V XX YY K 3 4 5 2 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) Two digit year code, e.g., `03' Two digit work week ranging from `01' to `53' Assembly package code Reflow Profile (Black Package, No Suffix) 300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) Time above 183C, 60-150 sec 215C, 10-30 s 225 C peak Ramp up = 3C/sec * Peak reflow temperature: 225C (package surface temperature) * Time of temperature higher than 183C for 60-150 seconds * One time soldering reflow is recommended 7 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com H11AA1, H11AA3, H11AA2, H11AA4 AC Input/Phototransistor Optocouplers TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM 2 E CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I16 8 H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0 www.fairchildsemi.com |
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